PI polyimide parts for semiconductor

Polyimide has the characteristics of high and low temperature resistance (- 269~400 ℃), high friction resistance, chemical stability, mechanical toughness, natural lubrication, high temperature insulation, etc. It is an ideal design material that can reduce component weight, extend maintenance intervals or lifespan, and reduce overall costs by increasing process uptime.

Its main characteristics include:

Good performance at high temperatures

Good chemical resistance

High strength, hardness, and dimensional stability

Higher operating temperature in the air

Maintaining excellent mechanical strength, stiffness, and creep resistance over a wide temperature range

High resistance to friction

UV resistance

High energy irradiation resistance

Inherently low flammability

Performance Table

       

Product nameNJSSPI-1003NJSSPI-1006NJSSPI-1007NJSSPI-1008
ProjectUnits Test data
Densityg/cm3 1.451.401.401.30
Heat distortion temperature℃ 380260300220
Coefficient of thermal expansion/℃ 5×10-52×10-55×10-55×10-5
Tensile strengthMPa 62.6495.00127.00110.00
Elongation at break4.917.006.2010.00
Bending strengthMPa149.00150.0094.00125.00
Bending modulusGPa 3.003.002.342.50
Compressive strength MPa136.50120.00162.00100.00
Coefficient of friction-0.25-0.350.25-0.350.25-0.350.25-0.35
Dielectric strengthKV/mm400.00134.00180.00
Dielectric constant-2.8-3.43.0-3.22.8-3.43.0
Surface resistivityΩ1015  1014 2.6×10151015
Volume resistivityΩ.cm1016 1016 6.7×10151016
Hardness (shore D)HD85858585
Notched impact strengthkJ/m219.0025.0012.0020.00
Water absorption≤0.3≤0.3≤0.3≤0.3
Low temperature resistance-248.00 -248.00 -248.00 -248.00 
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